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TLE4729G - Infineon

Description: Infineon TLE4729G, Stepper Motor Driver 2-Phase Step Motor,, 24-Pin DSO

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TLE4729G - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - so-24
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TLE4729G - Infineon  - 3D model - Small Outline Packages - so-24
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TLE4729G Details

  • Manufacturer Part Number:

    TLE4729G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SO-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    15.6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.6 mm

TLE4729G Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLE4729G involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. Additionally, it's recommended to use a separate power plane for the IC and to avoid routing high-frequency signals near the IC.
  • To ensure proper cooling, it's recommended to attach a heat sink to the TLE4729G, especially in high-power applications. The heat sink should be designed to provide good thermal conductivity and should be attached using a thermal interface material. Additionally, ensuring good airflow around the heat sink can also help to improve cooling.
  • Operating the TLE4729G at high temperatures can reduce its reliability and lifespan. High temperatures can also affect the IC's performance, leading to reduced efficiency and increased power losses. It's recommended to operate the IC within its specified temperature range to ensure optimal performance and reliability.
  • To troubleshoot issues with the TLE4729G, start by checking the input voltage and current, as well as the output voltage and current. Verify that the IC is properly cooled and that the PCB layout is correct. Check for any signs of physical damage or overheating. If the issue persists, consult the datasheet and application notes for guidance, or contact Infineon's technical support team for assistance.
  • Yes, the TLE4729G can be used in a redundant or parallel configuration to achieve higher power outputs. However, this requires careful design and layout considerations to ensure proper synchronization and current sharing between the ICs. Consult the datasheet and application notes for guidance on designing parallel or redundant configurations.

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TLE4729G Overview

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