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TLE6368G2AUMA1 - Infineon

Description: Infineon TLE6368G2AUMA1, Triple-Channel, Step Down DC-DC Power Supply Module, Selectable 36-Pin, DSO-36-26

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TLE6368G2AUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-36_
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TLE6368G2AUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-36_
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TLE6368G2AUMA1 Details

  • Manufacturer Part Number:

    TLE6368G2AUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC, SOP-36

  • Country Of Origin:

    Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Terminal Finish:

    Tin (Sn)

TLE6368G2AUMA1 Frequently Asked Questions (FAQs)

  • A good PCB layout practice is to keep the high-frequency components (e.g., the TLE6368G2AUMA1) away from the low-frequency components, and to use a solid ground plane to reduce EMI. Additionally, it is recommended to use a shielded cable for the LIN bus to minimize radiation.
  • The TLE6368G2AUMA1 requires a single 5V power supply. It is recommended to power the device after the 5V supply is stable and within the specified voltage range. The power sequencing requirements are not critical, but it is recommended to power the device after the 5V supply is stable to ensure proper operation.
  • The maximum cable length supported by the TLE6368G2AUMA1 for the LIN bus is approximately 40 meters, depending on the cable characteristics and the system requirements. However, it is recommended to follow the LIN bus specification and the system requirements for the specific application.
  • To troubleshoot issues with the TLE6368G2AUMA1, first check the power supply and the PCB layout to ensure they meet the recommended specifications. Then, use a logic analyzer or an oscilloscope to verify the LIN bus signals and check for any errors or anomalies. Additionally, verify the software configuration and the LIN bus protocol implementation.
  • The TLE6368G2AUMA1 has a maximum junction temperature of 150°C. To ensure proper thermal management, it is recommended to provide a heat sink or a thermal pad on the PCB, and to ensure good airflow around the device. Additionally, it is recommended to follow the thermal design guidelines provided in the datasheet.

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TLE6368G2AUMA1 Overview

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