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TLE94713ESXUMA1 - Infineon

Description: CAN Interface IC OPTIREG SYST BASIS CHIPS

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TLE94713ESXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSDSO-24-1_2025
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TLE94713ESXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-TSDSO-24-1_2025
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TLE94713ESXUMA1 Details

  • Manufacturer Part Number:

    TLE94713ESXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    5.5 V

  • Supply Voltage-Nom (Vsup):

    13.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TLE94713ESXUMA1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLE94713ESXUMA1 should include a solid ground plane, wide power traces, and a thermal relief pattern around the device to facilitate heat dissipation. It's also recommended to place the device near a heat sink or a metal plate to improve thermal performance.
  • To ensure proper configuration, carefully review the datasheet and application notes, and consult with Infineon's technical support team if necessary. Also, use the device's evaluation board or a similar development platform to test and validate your configuration before implementing it in your final design.
  • When selecting external components, consider the device's operating frequency, voltage rating, and current handling capabilities. Choose components with suitable voltage and current ratings, and ensure they can handle the device's switching frequency. Additionally, consider the component's power dissipation, ESR, and ESL to ensure optimal performance.
  • To troubleshoot issues with the TLE94713ESXUMA1, start by reviewing the datasheet and application notes, and checking the device's configuration and PCB layout. Use oscilloscopes and logic analyzers to monitor the device's signals and identify potential issues. Consult Infineon's technical support team or online forums for guidance and potential solutions.
  • To ensure reliable operation over temperature, consider the device's thermal characteristics, such as its junction-to-ambient thermal resistance and maximum junction temperature. Implement a suitable thermal management strategy, such as using heat sinks, thermal interfaces, or forced air cooling, to keep the device within its recommended operating temperature range.

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TLE94713ESXUMA1 Overview

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