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TLE9471ESXUMA1 - Infineon

Description: INFINEON - TLE9471ESXUMA1 - SYSTEM BASIS CHIP, AEC-Q100, 150DEG C

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TLE9471ESXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSDSO-24
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TLE9471ESXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-TSDSO-24
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TLE9471ESXUMA1 Details

  • Manufacturer Part Number:

    TLE9471ESXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    5.5 V

  • Supply Voltage-Nom (Vsup):

    13.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TLE9471ESXUMA1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLE9471ESXUMA1 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. Additionally, it's recommended to place the device near a heat sink or a metal plate to further improve thermal performance.
  • To ensure proper configuration, refer to the device's datasheet and application notes, and consult with Infineon's technical support team if necessary. Additionally, consider factors such as input voltage, output current, and fault detection requirements to select the optimal configuration for your application.
  • When designing a fault-tolerant system using the TLE9471ESXUMA1, consider implementing redundant power paths, using fault detection and diagnosis mechanisms, and incorporating error correction mechanisms. Additionally, ensure that the system can detect and respond to faults in a timely and reliable manner.
  • To troubleshoot issues with the TLE9471ESXUMA1, start by consulting the device's datasheet and application notes. Check the device's configuration, input voltage, and output current. Use oscilloscopes or logic analyzers to monitor the device's signals and identify potential issues. If necessary, contact Infineon's technical support team for further assistance.
  • In high-temperature environments, ensure the TLE9471ESXUMA1 is properly heat-sinked and consider using thermal interface materials to improve heat transfer. Monitor the device's junction temperature and adjust the system's thermal design accordingly. Additionally, consider using thermal simulation tools to optimize the system's thermal performance.

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TLE9471ESXUMA1 Overview

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