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TLF35584QVVS1 - Infineon

Description: Infineon DC/DC CONVERTER

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PCB Footprints
TLF35584QVVS1 - Infineon PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - PG-VQFN-48_2022
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3D Models
TLF35584QVVS1 - Infineon  - 3D model - Quad Flat No-Lead - PG-VQFN-48_2022
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TLF35584QVVS1 Details

  • Manufacturer Part Number:

    TLF35584QVVS1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    14

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER SUPPLY MANAGEMENT CIRCUIT

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC48(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

TLF35584QVVS1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider using a thermal interface material (TIM) to improve heat transfer.
  • The critical timing parameters include the clock frequency, clock duty cycle, and setup/hold times for the input signals. Refer to the datasheet for specific values and ensure that your design meets these requirements.
  • Use proper PCB layout techniques, such as separating analog and digital circuits, using shielding, and implementing EMI filters. Also, ensure that your design meets the relevant EMC standards and regulations.
  • Use a combination of ceramic and electrolytic capacitors for power supply decoupling. Implement a pi-filter or a common-mode choke to filter out noise and ensure a stable power supply.

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TLF35584QVVS1 Overview

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