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TLIN1022DMTRQ1 - Texas Instruments

Description: LIN Transceiver with Integrated Vreg 20kBd Automotive 14-Pin VSON EP T/R

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TLIN1022DMTRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
TLIN1022DMTRQ1 - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DMT0014A
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3D Models
TLIN1022DMTRQ1 - Texas Instruments - 3D model - Small Outline No-lead - DMT0014A
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TLIN1022DMTRQ1 Details

  • Manufacturer Part Number:

    TLIN1022DMTRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-12-24

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    20 Mbps

  • JESD-30 Code:

    R-PDSO-N14

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLIN1022DMTRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The TLIN1022DMTRQ1 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a thermal pad connected to a ground plane can be used to dissipate heat. Additionally, the device should be placed in a way that allows for good airflow to help dissipate heat.
  • The maximum cable length supported by TLIN1022DMTRQ1 depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at data rates up to 10 Gbps. For longer cable lengths or higher data rates, signal repeaters or active cables may be required.
  • The TLIN1022DMTRQ1 can be configured for different data rates using the device's control pins and registers. The device supports data rates from 10 Mbps to 10 Gbps, and the specific configuration depends on the desired data rate and application. Refer to the device's datasheet and application notes for more information on configuration and programming.
  • The power consumption of TLIN1022DMTRQ1 depends on the specific application and operating conditions. However, the typical power consumption is around 1.2 W at 10 Gbps data rate. The device also has a low-power mode that can reduce power consumption to around 100 mW.

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TLIN1022DMTRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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