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TLIN1027DRQ1 - Texas Instruments

Description: LIN Transceivers Automotive local interconnect network (LIN) transceiver for K-line applications 8-SOIC -40 to 125

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TLIN1027DRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
TLIN1027DRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLIN1027DRQ1 - Texas Instruments - 3D model - Small Outline Packages - D0008A
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TLIN1027DRQ1 Details

  • Manufacturer Part Number:

    TLIN1027DRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-07-03

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    20 Mbps

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2.1 mA

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    LIN TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLIN1027DRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode choke or a ferrite bead to filter out high-frequency noise.
  • Ensure good thermal management by providing adequate heat sinking and airflow. Use a thermal interface material (TIM) to improve heat transfer between the device and the heat sink. Monitor the device's junction temperature and adjust the system design accordingly.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials and equipment, and ensure that the device is properly grounded during handling.
  • Yes, TLIN1027DRQ1 is designed for high-speed data transmission up to 10 Gbps. However, ensure that the PCB layout and signal integrity are optimized for high-speed signals, and use proper termination and equalization techniques to minimize signal degradation.
  • Use a combination of oscilloscopes, logic analyzers, and signal generators to debug the issue. Check the device's power supply, signal integrity, and termination. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.

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TLIN1027DRQ1 Overview

Use the download button to access the TLIN1027DRQ1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLIN1, or try a keyword search, such as Network Interfaces

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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