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TLIN2022ADRQ1 - Texas Instruments

Description: Fault protected dual local interconnect Network (LIN) transceiver with dominant state timeout

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TLIN2022ADRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
TLIN2022ADRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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3D Models
TLIN2022ADRQ1 - Texas Instruments - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLIN2022ADRQ1 Details

  • Manufacturer Part Number:

    TLIN2022ADRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ESD for LIN, VSUP pins is 3B; Transmit Data rate is 20kbps

  • Data Rate:

    20 Mbps

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    14

  • Number of Transceivers:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    8.5 mA

  • Supply Voltage-Nom:

    8 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    LIN TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLIN2022ADRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLIN2022ADRQ1 evaluation module documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The TLIN2022ADRQ1 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Follow the recommended thermal management guidelines in the datasheet and application notes.
  • The TLIN2022ADRQ1 has an operating temperature range of -40°C to 125°C, but it's essential to consider the junction temperature (Tj) which should not exceed 150°C. Ensure proper thermal management to prevent overheating and reduce the risk of device failure.
  • To minimize power consumption, ensure that the device is operated within the recommended voltage range (1.7V to 5.5V), and adjust the clock frequency according to your application's requirements. Additionally, use the power-down mode when the device is not in use to reduce power consumption.
  • The TLIN2022ADRQ1 requires proper input and output termination to ensure signal integrity. Use a series resistor (Rs) of 22-47 ohms for input termination, and a parallel resistor (Rp) of 50-100 ohms for output termination. Refer to the datasheet and application notes for more information.

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TLIN2022ADRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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