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TLK2201BRCP - Texas Instruments

Description: Texas Instruments TLK2201BRCP Ethernet Transceiver, IEEE 802.3, 1.6Gbit/s 2.5 V, 64-Pin HVQFP

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TLK2201BRCP - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - RCP (S-PQFP-G64)
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TLK2201BRCP - Texas Instruments  - 3D model - Quad Flat Packages - RCP (S-PQFP-G64)
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TLK2201BRCP Details

  • Manufacturer Part Number:

    TLK2201BRCP

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Pin Count:

    64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A991.B.1

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Data Rate:

    1600000 Mbps

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVFQFP

  • Package Equivalence Code:

    TQFP64,.47SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.111 mA

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

TLK2201BRCP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLK2201BRCP datasheet, but it's also important to follow general high-speed PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using impedance-controlled traces.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal design, and consider the device's thermal derating. Additionally, ensure that the device is properly soldered and that the PCB is designed to handle thermal stresses.
  • To mitigate EMI and RFI, use a shielded enclosure, keep the device away from noise sources, use a common-mode choke, and ensure that the PCB is designed with EMI and RFI in mind. Additionally, follow the recommended layout and routing guidelines, and use EMI-absorbing materials if necessary.
  • To troubleshoot issues with the TLK2201BRCP, start by checking the device's power supply, clock signals, and data transmission lines. Use oscilloscopes and logic analyzers to debug the signals, and verify that the device is properly configured and initialized. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • When using the TLK2201BRCP in a system with multiple voltage domains, ensure that the device's power supply and I/O signals are properly isolated and level-shifted. Use voltage translators or level shifters to ensure that the signals are compatible with the device's voltage domain, and follow the recommended power sequencing and voltage ramp-up guidelines.

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TLK2201BRCP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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