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TLK2711JRZQE - Texas Instruments

Description: Serializers & Deserializers - Serdes 1.6-2.7GBPS Xceiver

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TLK2711JRZQE - Texas Instruments PCB footprint - BGA - BGA - GQE(S-PBGA-N80)_2021_1
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3D Models
TLK2711JRZQE - Texas Instruments  - 3D model - BGA - GQE(S-PBGA-N80)_2021_1
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TLK2711JRZQE Details

  • Manufacturer Part Number:

    TLK2711JRZQE

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-80

  • Pin Count:

    80

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B80

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA80,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

TLK2711JRZQE Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLK2711JRZQE involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the transmission lines. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable operation of the TLK2711JRZQE in high-temperature environments, it's essential to provide adequate heat sinking, use a thermally conductive PCB material, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • When using the TLK2711JRZQE in a system with multiple voltage rails, it's essential to ensure that the device is powered from a stable voltage source, and that the voltage rails are properly sequenced during power-up and power-down. Additionally, consider using voltage translators or level shifters to ensure compatible voltage levels between different domains.
  • To troubleshoot issues with the TLK2711JRZQE, use a combination of oscilloscopes, logic analyzers, and protocol analyzers to capture and analyze the signals. Check for signal integrity issues, such as jitter, ringing, or overshoot, and verify that the transmission lines are properly terminated. Also, review the system design and ensure that the device is properly configured and powered.
  • To minimize electromagnetic interference (EMI) and radio-frequency interference (RFI) with the TLK2711JRZQE, use proper shielding, grounding, and filtering techniques. Ensure that the device is placed in a shielded enclosure, and use EMI filters or common-mode chokes to reduce emissions. Additionally, follow good PCB design practices, such as using a solid ground plane and minimizing the length of transmission lines.

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TLK2711JRZQE Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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