- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for TLP2166A(F)
- Part Number TLP2166A(F)
- Manufacturer Toshiba
- Pin Count 8
- Part Category Phototransistor
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - 11-5K1S_2022
- Released Date Apr 13, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
TLP2166A(F) Details
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Manufacturer Part Number:
TLP2166A(F)
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Rohs Code:
Yes
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Part Life Cycle Code:
End Of Life
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Package Description:
SOP-8
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HTS Code:
8541.40.80.00
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Manufacturer:
Toshiba America Electronic Components
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YTEOL:
1
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Configuration:
SEPARATE, 2 CHANNELS
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Data Rate-Nom:
15 MBps
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Forward Current-Max:
0.015 A
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Isolation Voltage-Max:
2500 V
TLP2166A(F) Frequently Asked Questions (FAQs)
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A good PCB layout for the TLP2166A(F) involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 10uF capacitor between the VIN pin and GND pin to filter out noise.
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To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to dissipate heat efficiently, and thermal interface material (TIM) can be used to improve heat transfer between the device and heat sink.
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When handling the TLP2166A(F), it's essential to take precautions to prevent damage from electrostatic discharge (ESD). Use an anti-static wrist strap or mat, and handle the device by the body or pins, avoiding touching the die. Also, avoid bending or flexing the leads, and use a vacuum pickup tool to handle the device.
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Yes, the TLP2166A(F) is suitable for high-reliability applications. It's manufactured using a robust process, and Toshiba provides a range of reliability data, including FIT rates and MTBF calculations, to support its use in demanding applications.
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To troubleshoot issues with the TLP2166A(F), start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly soldered and that the PCB layout is correct. Use a thermal camera or thermometer to check for overheating, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
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TLP2166A(F) Overview
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