Toshiba recommends a PCB layout with a solid ground plane, short traces, and minimal vias to minimize noise and ensure reliable operation. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
The TLP2348 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and avoid blocking the airflow with components or obstacles.
Although the datasheet specifies a recommended operating voltage range of 3.3V to 5V, the absolute maximum rating for the VCC pin is 6V. However, it is not recommended to operate the device at this voltage for extended periods, as it may affect reliability and lifespan.
The TLP2348 is rated for operation up to 85°C, but it can be used in higher temperature environments with derating. Consult the datasheet for derating curves and ensure that the device is properly heat-sinked and cooled.
To ensure EMC, follow proper PCB layout and design guidelines, use a shielded enclosure, and ensure that the device is properly decoupled with capacitors. Additionally, consider using electromagnetic interference (EMI) filters or common-mode chokes to reduce emissions.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
TLP2348 Overview
Use the download button to access the TLP2348 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLP23,
or try a keyword search, such as Optocoupler
