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TLP250(D4,F) - Toshiba

Description: PHOTOCOUPLER

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PCB Footprints
TLP250(D4,F) - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 11-10C4 (8PDIP)
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3D Models
TLP250(D4,F) - Toshiba  - 3D model - Dual-In-Line Packages - 11-10C4 (8PDIP)
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TLP250(D4,F) Details

  • Manufacturer Part Number:

    TLP250(D4,F)

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DIP-8

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Additional Feature:

    UL RECOGNIZED, VDE APPROVED

  • Configuration:

    COMPLEX

  • Forward Current-Max:

    0.02 A

  • Isolation Voltage-Max:

    2500 V

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Response Time-Max:

    5e-7 s

  • Response Time-Nom:

    1.5e-7 ns

  • Supply Voltage-Min:

    15 V

  • Surface Mount:

    NO

TLP250(D4,F) Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a ground plane underneath the IC, and a 0.1uF bypass capacitor between VCC and GND pins, as close to the IC as possible, to minimize noise and ensure stable operation.
  • The input signal should be a clean, logic-level signal with a rise and fall time of less than 10ns. It's recommended to use a series resistor (e.g., 1kΩ) and a bypass capacitor (e.g., 10nF) to filter out noise and ringing.
  • The maximum cable length depends on the specific application and the characteristics of the cable. As a general guideline, Toshiba recommends keeping the cable length below 10 meters to ensure reliable operation. However, it's possible to drive longer cables with proper termination and signal conditioning.
  • The TLP250 is rated for operation up to 125°C. However, it's essential to consider the derating of the output current and the increase in propagation delay at higher temperatures. Consult the datasheet and application notes for more information.
  • To ensure EMC, follow proper PCB layout and design guidelines, such as keeping the TLP250 away from noise sources, using a ground plane, and adding shielding or filtering if necessary. Additionally, consider using a common-mode choke or a ferrite bead to reduce electromagnetic interference.

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TLP250(D4,F) Overview

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