Description:Package: SO6L
(2) Operating temperature: -40 to 125
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(3) Current transfer ratio: 900 % (min) @I
F = 0.5 mA
(4) Maximum output current: 80 mA
(5) Propagation delay time: tpHL = 15
µs (max), tpLH = 50
µs (max) @ R
L = 4.7 k
Ω, I
F = 0.5 mA, T
a = 25
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(6) Isolation voltage: 5000 Vrms (min)
(7) Safety standards
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)
CQC-approved: GB4943.
Toshiba recommends a PCB layout with a solid ground plane, short traces, and minimal impedance to ensure high-speed signal integrity and minimize electromagnetic interference (EMI). A 4-layer PCB with a dedicated ground plane is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design guidelines, such as providing adequate heat sinking, using thermal vias, and keeping the junction temperature (Tj) below the maximum rating of 125°C.
The maximum cable length supported by the TLP2703 depends on the specific application and signal frequency. As a general guideline, Toshiba recommends keeping the cable length below 10 meters for high-speed signals (up to 100 Mbps) and below 30 meters for low-speed signals (up to 10 Mbps).
Yes, the TLP2703 can be used in redundant or duplicated system designs. However, it is essential to ensure that the devices are properly synchronized and that the system is designed to handle the increased power consumption and heat generation.
To troubleshoot common issues with the TLP2703, it is recommended to follow a systematic approach, including checking the PCB layout, signal integrity, power supply, and device configuration. Toshiba also provides application notes and technical support resources to help with troubleshooting.
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TLP2703 Overview
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