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TLP2768A(E - Toshiba

Description: High Speed IC Coupler; SO6L

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TLP2768A(E - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - 11-4N1A_2021
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TLP2768A(E - Toshiba  - 3D model - Small Outline Packages - 11-4N1A_2021
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TLP2768A(E Details

  • Manufacturer Part Number:

    TLP2768A(E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-6

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    9

  • Additional Feature:

    OPEN COLLECTOR, UL APPROVED

  • Configuration:

    SINGLE

  • Data Rate-Nom:

    20 MBps

  • Forward Current-Max:

    0.025 A

  • Isolation Voltage-Max:

    5000 V

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    0.025 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Packing Method:

    MAGAZINE

  • Response Time-Nom:

    3e-8 ns

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

TLP2768A(E Frequently Asked Questions (FAQs)

  • Toshiba provides a recommended PCB layout in the application note 'TLP2768A(E) PCB Layout Guide' which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and reliability.
  • The TLP2768A(E) has a high power dissipation, so thermal management is crucial. Toshiba recommends using a heat sink, thermal vias, and thermal pads to dissipate heat. The application note 'TLP2768A(E) Thermal Management' provides more detailed guidelines.
  • Although the datasheet specifies the recommended operating voltage range, the absolute maximum voltage rating for the input pins is 7V. Exceeding this voltage can cause damage to the device.
  • Yes, the TLP2768A(E) is suitable for high-frequency applications up to 100 MHz. However, it's essential to follow the recommended PCB layout and take into account the device's propagation delay and rise/fall times to ensure signal integrity.
  • To ensure EMC, follow the recommended PCB layout, use a shielded enclosure, and implement proper grounding and shielding techniques. Additionally, consider using EMI filters and ferrite beads to reduce electromagnetic interference.

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TLP2768A(E Overview

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