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TLP293-4(LA-TP,E - Toshiba

Description: Transistor Output Optocouplers 4ch Transistor opto coupler

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TLP293-4(LA-TP,E - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - 11-11F1
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3D Models
TLP293-4(LA-TP,E - Toshiba  - 3D model - Small Outline Packages - 11-11F1
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TLP293-4(LA-TP,E Details

  • Manufacturer Part Number:

    TLP293-4(LA-TP,E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A001.a.2.c

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    8

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SEPARATE, 4 CHANNELS

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    80 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    4

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Power Dissipation-Max:

    0.1 W

  • Response Time-Max:

    0.000002 s

  • Surface Mount:

    YES

TLP293-4(LA-TP,E Frequently Asked Questions (FAQs)

  • The recommended soldering temperature is 260°C for 10 seconds or less, to prevent damage to the device.
  • Handle the device by the body, not the leads, to prevent damage and ensure optimal performance.
  • Store the device in a dry, dark place at a temperature range of 5°C to 30°C and humidity below 60%.
  • The device is rated for operation up to 85°C, but prolonged exposure to high temperatures may affect its performance and lifespan.
  • Use a soft brush and a mild detergent solution to clean the device. Avoid using harsh chemicals or abrasive materials that may damage the device.

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TLP293-4(LA-TP,E Overview

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