TLP627MF(TP4,E footprint, schematic symbol and 3D model by Toshiba

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TLP627MF(TP4,E Details

The recommended soldering temperature is 260°C (500°F) and the recommended soldering time is 3 seconds or less to prevent damage to the device.
Handle the device by the body, not the leads, and store it in a dry, dark place to prevent damage from light, moisture, and mechanical stress.
The recommended operating temperature range is -20°C to 85°C (-4°F to 185°F), but the device can withstand storage temperatures from -40°C to 100°C (-40°F to 212°F).
Bias the device with a reverse voltage of 5V to 10V and a current of 10μA to 100μA for optimal performance, but be careful not to exceed the maximum ratings.
The typical response time of the TLP627MF(TP4) is 10ns to 20ns, but this can vary depending on the specific application and operating conditions.

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