Part Image

TLV1824QDRQ1 - Texas Instruments

Description: Qualified for automotive applications • AEC-Q100 qualified with the following results: – Device temperature grade 1: –40°C to 125°C ambient operating temperature range – Device HBM ESD classification level 2 – Device CDM ESD classification level C3 • Wide 2.4 V to 40 V supply range • Low quiescent current 5 μA per channel • Rail-to-Rail input • Power-On Reset (POR) for known start-up • Low input offset voltage 500 μV • 420 ns typical propagation delay • Push-pull output option (TLV181x-Q1) • Op

Download TLV1824QDRQ1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TLV1824QDRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 14 Ld SOIC
click to zoom
3D Models
TLV1824QDRQ1 - Texas Instruments  - 3D model - Small Outline Packages - 14 Ld SOIC
click to zoom

TLV1824QDRQ1 Details

  • Manufacturer Part Number:

    TLV1824QDRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.0012 µA

  • Bias Current-Max (IIB) @25C:

    0.0012 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    900 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage Limit-Max:

    42 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV1824QDRQ1 Overview

Use the download button to access the TLV1824QDRQ1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV18, or try a keyword search, such as Comparators

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV1824QDRQ1

Showing 0 results