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TLV197QDGKRQ1 - Texas Instruments

Description: Operational Amplifiers - Op Amps Automotive, single channel, high-voltage, precision, RRIO op amp

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TLV197QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - VSSOP - 1.1 mm max height
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TLV197QDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - VSSOP - 1.1 mm max height
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TLV197QDGKRQ1 Details

  • Manufacturer Part Number:

    TLV197QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-04-30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00002 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    120 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00002 µA

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -3 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    316227

  • Wideband:

    NO

  • Width:

    3 mm

TLV197QDGKRQ1 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV197QDGKRQ1 is 670 mW, which is calculated based on the maximum junction temperature and thermal resistance.
  • To ensure stability, make sure to follow the recommended compensation capacitor values and placement, and consider using a series resistor in the feedback path to reduce ringing and oscillations.
  • Keep the input and output traces short and away from noise sources, use a solid ground plane, and consider using a guard ring around the op-amp to reduce noise and interference.
  • The TLV197QDGKRQ1 is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. Ensure proper heat sinking and thermal management to prevent overheating.
  • Use proper ESD handling procedures, such as wearing an anti-static wrist strap, using an anti-static mat, and storing the device in an anti-static bag when not in use.

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TLV197QDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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