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TLV2170IDGKR - Texas Instruments

Description: 36V, 1.2 MHz, microPower, Rail-to-Rail Output, General Purpose Op Amp

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TLV2170IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2170IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2170IDGKR Details

  • Manufacturer Part Number:

    TLV2170IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-11-17

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -2 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.35 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Wideband:

    NO

  • Width:

    3 mm

TLV2170IDGKR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV2170IDGKR involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a star-ground configuration and to avoid routing high-frequency signals near the device.
  • The output capacitor should be chosen based on the desired output voltage ripple, output current, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10uF to 22uF, with a voltage rating of at least 2x the output voltage. X5R or X7R ceramic capacitors are recommended for their low ESR and high reliability.
  • The TLV2170IDGKR has an absolute maximum input voltage rating of 18V. However, it's recommended to operate the device within the recommended input voltage range of 4.5V to 15V to ensure optimal performance and reliability.
  • To ensure stability, it's essential to follow the recommended PCB layout guidelines, use a suitable output capacitor, and ensure that the input voltage is within the recommended range. Additionally, it's recommended to add a small ceramic capacitor (e.g., 10nF) between the VIN and GND pins to filter out high-frequency noise.
  • The thermal derating curve for the TLV2170IDGKR can be found in the datasheet. In general, the device's power dissipation capability decreases as the ambient temperature increases. It's essential to ensure that the device operates within the recommended temperature range (-40°C to 125°C) and that the PCB design allows for adequate heat dissipation.

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TLV2170IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV2170IDGKT Texas Instruments

Operational Amplifier, 2 Func, 2500uV Offset-Max, CMOS, PDSO8