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TLV2231CDBVT - Texas Instruments

Description: Texas Instruments TLV2231CDBVT Op Amp, 2MHz CMOS, Rail to Rail, 3 → 9 V, 5-Pin SOT-23

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PCB Footprints
TLV2231CDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
TLV2231CDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV2231CDBVT Details

  • Manufacturer Part Number:

    TLV2231CDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00015 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.5 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    300

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2231CDBVT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the TLV2231CDBVT placed close to the power supply bypass capacitors. The input and output pins should be routed away from each other to minimize noise coupling. A ground plane is also recommended to reduce noise and improve thermal performance.
  • The TLV2231CDBVT has a thermal pad on the bottom of the package that should be connected to a thermal ground plane or a heat sink to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink. The maximum junction temperature (TJ) should not exceed 150°C.
  • Texas Instruments recommends using ceramic capacitors with a value of 10nF to 100nF for input and output bypassing. The capacitors should be placed as close as possible to the device pins to minimize inductance and improve noise filtering.
  • To ensure stability, the TLV2231CDBVT requires a minimum load capacitance of 10nF. The device should also be operated within its recommended operating conditions, including supply voltage, input common-mode range, and output current. Additionally, the layout should be designed to minimize parasitic inductance and capacitance.
  • The TLV2231CDBVT has built-in ESD protection on its input and output pins, which can withstand electrostatic discharges up to 2kV according to the Human Body Model (HBM) and 200V according to the Charged Device Model (CDM). However, it is still recommended to follow proper ESD handling procedures when handling the device.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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