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TLV2313IDGKR - Texas Instruments

Description: Low-Power, RRIO, 750-uV Offset, 1-MHz Operational Amplifier for Cost-Sensitive Systems

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TLV2313IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2313IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2313IDGKR Details

  • Manufacturer Part Number:

    TLV2313IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-06-18

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.18 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2313IDGKR Frequently Asked Questions (FAQs)

  • It is recommended to place the TLV2313IDGKR close to the power supply and analog signal sources, and to use a star-ground configuration to minimize noise. Additionally, it is recommended to use a solid ground plane and to keep the analog and digital grounds separate.
  • Ensure that the TLV2313IDGKR is operated within its recommended operating conditions by checking the voltage supply, temperature, and output current. The recommended operating conditions can be found in the datasheet.
  • The TLV2313IDGKR can drive a maximum capacitive load of 1000pF. Exceeding this limit may cause instability or oscillation.
  • To reduce noise and ripple in the output voltage, use a low-ESR capacitor (e.g. ceramic or film capacitor) at the output, and consider adding a noise-reducing capacitor (e.g. 10uF) in parallel with the output capacitor.
  • The thermal resistance of the TLV2313IDGKR package is 54.4°C/W (junction-to-ambient) and 24.4°C/W (junction-to-case).

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TLV2313IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV2313IDGKT Texas Instruments

Operational Amplifier, 2 Func, 3000uV Offset-Max, CMOS, PDSO8