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TLV2316IDGKT - Texas Instruments

Description: 10-MHz, Low-Noise, RRIO, CMOS Operational Amplifier for Cost-Sensitive Systems

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TLV2316IDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2316IDGKT Details

  • Manufacturer Part Number:

    TLV2316IDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-02-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    6 V/us

  • Supply Current-Max:

    1150 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2316IDGKT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2316IDGKT is 1.4W. However, it's recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the package.
  • To ensure stability, it's recommended to use a capacitor with a value between 10nF to 100nF between the VCC and GND pins, and to keep the input and output capacitors as close to the device as possible.
  • It's recommended to keep the input and output traces as short as possible, and to use a ground plane to minimize noise and electromagnetic interference (EMI). Additionally, it's recommended to use a single-point ground and to avoid routing signals under the device.
  • The TLV2316IDGKT has a built-in thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. To handle this feature, it's recommended to implement a thermal monitoring system to detect when the device is approaching the thermal shutdown threshold.
  • The recommended input voltage range for the TLV2316IDGKT is 2.7V to 5.5V. Operating the device outside of this range may affect its performance and reliability.

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TLV2316IDGKT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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