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TLV2361CDBVR - Texas Instruments

Description: Single High-Performance, Low-Voltage Operational Amplifier

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TLV2361CDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A  HEIGHT 1.45
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TLV2361CDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A  HEIGHT 1.45
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TLV2361CDBVR Details

  • Manufacturer Part Number:

    TLV2361CDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.15 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.1 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -3.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -1.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    3 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage Limit-Max:

    3.5 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2361CDBVR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2361CDBVR is 670 mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the TLV2361CDBVR is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not be exceeded.
  • To minimize noise and ensure optimal performance, follow good PCB layout practices such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, avoid running high-frequency signals near the op-amp inputs.
  • While the TLV2361CDBVR is an op-amp, it can be used as a comparator in some applications. However, it's not recommended for high-speed or high-frequency comparator applications due to its limited slew rate and bandwidth. A dedicated comparator device may be a better choice for such applications.
  • The recommended decoupling capacitor value for the TLV2361CDBVR is 0.1 μF to 1 μF, depending on the specific application and PCB layout. A larger capacitor value may be required for high-current or high-frequency applications.

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TLV2361CDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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