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TLV2361IDBVR - Texas Instruments

Description: Single High-Performance, Low-Voltage Operational Amplifier

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PCB Footprints
TLV2361IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
TLV2361IDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV2361IDBVR Details

  • Manufacturer Part Number:

    TLV2361IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.15 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.1 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -3.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -1.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    3 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage Limit-Max:

    3.5 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2361IDBVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the op-amp inputs and outputs close to the device, and the power supply decoupling capacitors placed as close as possible to the device pins. Additionally, it's recommended to keep the analog and digital grounds separate and connected only at the power supply.
  • To minimize EMI and RFI, use a shielded enclosure, keep the op-amp inputs and outputs away from high-frequency signals, and use a common-mode choke or ferrite bead on the power supply lines. Additionally, use a low-pass filter or a shielded cable for the input signals.
  • The TLV2361IDBVR can drive a maximum capacitive load of 100 pF. Exceeding this limit may cause oscillations or instability in the op-amp.
  • To ensure stability in a unity-gain configuration, add a 10-100 ohm resistor in series with the feedback path, and a 10-100 pF capacitor in parallel with the feedback path. This will help to reduce the phase shift and ensure stability.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) before applying the input signals. This ensures that the op-amp is properly biased and stable before the input signals are applied.

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TLV2361IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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