Please enter a minimum 3 letters or numbers
Technical Content
Part Image

TLV2362IDGKR - Texas Instruments

Description: Dual High-Performance, Low-Voltage Operational Amplifier

Download TLV2362IDGKR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
TLV2362IDGKR - Texas Instruments - PCB symbol
click to zoom
PCB Footprints
TLV2362IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
click to zoom
3D Models
TLV2362IDGKR - Texas Instruments - 3D model - Small Outline Packages - DGK
click to zoom

TLV2362IDGKR Details

  • Manufacturer Part Number:

    TLV2362IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.15 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.1 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -3.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -1.5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    3 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    3.5 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2362IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following a star-grounding layout, keeping the input and output traces separate, and using a solid ground plane to minimize noise. Additionally, it's essential to keep the feedback resistors close to the op-amp pins and use a low-impedance power supply.
  • The gain resistors should be chosen based on the desired gain and bandwidth requirements. A higher gain setting will result in a lower bandwidth, while a lower gain setting will result in a higher bandwidth. Texas Instruments provides a gain resistor calculator tool to help with the selection process.
  • The TLV2362IDGKR can drive a maximum capacitive load of 100 pF. Exceeding this limit can cause instability and oscillations. To ensure stability, it's recommended to add a series resistor (Rs) to the output stage to dampen the capacitive load.
  • The TLV2362IDGKR has a limited common-mode voltage range. If the input common-mode voltage exceeds the power supply rails, the op-amp may enter a high-impedance state or even latch up. To avoid this, ensure that the input common-mode voltage remains within the specified range, or add input protection circuitry to prevent overvoltage conditions.
  • The TLV2362IDGKR has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to keep the device within the specified operating temperature range (-40°C to 125°C) and provide adequate heat sinking. Texas Instruments provides thermal design guidelines and a thermal calculator tool to help with the design process.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV2362IDGKR Overview

Use the download button to access the TLV2362IDGKR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV23, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV2362IDGKR

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑