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TLV2369IDGKR - Texas Instruments

Description: 800-nA, 1.8-V, Rail-to-Rail I/O Op Amp with Zero-Crossover Distortion for Cost-Sensitive Application

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TLV2369IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2369IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2369IDGKR Details

  • Manufacturer Part Number:

    TLV2369IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-06-11

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00011 µA

  • Bias Current-Max (IIB) @25C:

    0.00011 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.005 V/us

  • Supply Current-Max:

    0.0026 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    12

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2369IDGKR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2369IDGKR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-22pF) between the output and the inverting input pins to prevent oscillations.
  • To minimize noise and EMI, it's recommended to keep the input and output traces short and away from each other, use a solid ground plane, and decouple the power supply pins with 0.1uF capacitors.
  • The TLV2369IDGKR is rated for operation up to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper heat sinking and thermal management to prevent overheating.
  • Choose resistors with a tolerance of 1% or better, and ensure the resistor values are within the recommended range (e.g., 1kΩ to 100kΩ) to maintain stability and accuracy.

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TLV2369IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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