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TLV2369IDGKT - Texas Instruments

Description: 800-nA, 1.8-V, Rail-to-Rail I/O Op Amp with Zero-Crossover Distortion for Cost-Sensitive Application

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TLV2369IDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2369IDGKT - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2369IDGKT Details

  • Manufacturer Part Number:

    TLV2369IDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-06-11

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00011 µA

  • Bias Current-Max (IIB) @25C:

    0.00011 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.005 V/us

  • Supply Current-Max:

    0.0026 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    12

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2369IDGKT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the op-amp close to the feedback resistors, and the input and output capacitors placed close to the op-amp pins. Additionally, it's recommended to use a ground plane and to avoid routing high-frequency signals near the op-amp inputs.
  • To minimize EMI and RFI, use a shielded enclosure, keep the op-amp and surrounding components away from radiating sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, use a low-pass filter or a shielded cable to connect to the op-amp inputs.
  • The maximum power dissipation for the TLV2369IDGKT is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 670 mW at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the operating temperature and the thermal resistance of the PCB.
  • The TLV2369IDGKT is rated for operation up to 125°C, but the performance may degrade at high temperatures. It's recommended to derate the operating temperature based on the application requirements and to ensure that the device is properly heat-sinked to prevent thermal shutdown.
  • To troubleshoot oscillations or instability issues, check the PCB layout for parasitic capacitance and inductance, ensure that the op-amp is properly bypassed, and verify that the feedback network is properly designed. Additionally, check for voltage supply noise and ensure that the op-amp is operated within its recommended operating conditions.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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