Mainland China, Malaysia, Mexico, Philippines, Taiwan
ECCN Code:
EAR99
HTS Code:
8542.33.00.01
Manufacturer:
Texas Instruments
YTEOL:
0
Amplifier Type:
OPERATIONAL AMPLIFIER
Architecture:
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB):
0.00006 µA
Bias Current-Max (IIB) @25C:
0.00006 µA
Common-mode Reject Ratio-Min:
55 dB
Common-mode Reject Ratio-Nom:
72 dB
Frequency Compensation:
YES
Input Offset Current-Max (IIO):
0.00006 µA
Input Offset Voltage-Max:
4500 µV
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e4
Length:
2.9 mm
Low-Bias:
YES
Low-Offset:
NO
Micropower:
NO
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
6
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
LSSOP
Package Equivalence Code:
TSOP6,.11,37
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
1.45 mm
Slew Rate-Min:
1 V/us
Slew Rate-Nom:
2.4 V/us
Subcategory:
Operational Amplifier
Supply Current-Max:
0.66 mA
Supply Voltage Limit-Max:
16.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.95 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
3000
Voltage Gain-Min:
79432
Wideband:
YES
Width:
1.6 mm
TLV2370IDBVTG4 Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the TLV2370 datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, the TI website has a PCB layout guide for op-amps that provides general guidelines for minimizing noise and ensuring optimal performance.
The choice of resistors and capacitors for the feedback network depends on the specific application and desired frequency response. Texas Instruments provides a feedback network design tool on their website, which can help engineers select the correct components based on their specific requirements.
The maximum power dissipation of the TLV2370IDBVTG4 is dependent on the ambient temperature and the thermal resistance of the package. Engineers can use the thermal resistance values provided in the datasheet to calculate the maximum power dissipation. To ensure that the device does not overheat, engineers should provide adequate heat sinking and ensure good airflow around the device.
The TLV2370IDBVTG4 is rated for operation up to 125°C, but the device's performance and reliability may be affected at high temperatures. Engineers should consult the datasheet for temperature-related specifications and limitations, and consider using thermal protection and derating the device's power dissipation to ensure reliable operation.
Texas Instruments provides a troubleshooting guide for op-amps on their website, which covers common issues such as oscillation, instability, and noise. Engineers can also consult the TLV2370 datasheet and application notes for specific guidance on troubleshooting and debugging.
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TLV2370IDBVTG4 Overview
Use the download button to access the TLV2370IDBVTG4 schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
