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TLV2373IDGS - Texas Instruments

Description: Texas Instruments TLV2373IDGS, Dual Op Amp, 3MHz Rail-Rail, 3 → 15 V, 10-Pin MSOP

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TLV2373IDGS - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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TLV2373IDGS - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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TLV2373IDGS Details

  • Manufacturer Part Number:

    TLV2373IDGS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.4 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.32 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    79432

  • Wideband:

    YES

  • Width:

    3 mm

TLV2373IDGS Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLV2373IDGS is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and thermal resistance (RθJA) of 125°C/W.
  • To minimize noise and ensure stability, it is recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, the input and output traces should be kept short and away from noise sources.
  • The recommended input voltage range for TLV2373IDGS is 1.8V to 5.5V, although the device can operate from 1.7V to 6.5V. Operating outside the recommended range may affect the device's performance and accuracy.
  • The output capacitor should be chosen based on the desired output ripple voltage and stability requirements. A minimum output capacitance of 1uF is recommended, with a maximum ESR of 5 ohms. X5R or X7R ceramic capacitors are suitable options.
  • Yes, TLV2373IDGS is rated for operation from -40°C to 125°C. However, the device's performance and accuracy may degrade at high temperatures. It is recommended to derate the device's power dissipation and ensure proper thermal management to prevent overheating.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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