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TLV2376IDGKT - Texas Instruments

Description: Op Amp Dual GP R-R I/O ±2.75V/5.5V 8-Pin VSSOP T/R

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TLV2376IDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2376IDGKT - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2376IDGKT Details

  • Manufacturer Part Number:

    TLV2376IDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-11-02

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    88 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    100 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    2.4 mA

  • Supply Voltage Limit-Max:

    7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2376IDGKT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLV2376IDGKT is 670mW at 25°C free-air temperature, and it can be calculated using the formula: Pd = (TJ - TA) / θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance.
  • To ensure stability in the TLV2376IDGKT op-amp, it is recommended to use a capacitor with a value of 10nF to 100nF between the BYPASS pin and the GND pin, and to keep the input and output impedance low to minimize phase shift and oscillation.
  • For optimal performance, it is recommended to keep the input and output traces short and away from noise sources, use a ground plane to reduce noise and electromagnetic interference, and keep the power supply decoupling capacitors close to the VCC and GND pins.
  • Yes, the TLV2376IDGKT is rated for operation from -40°C to 125°C, but the maximum junction temperature should not exceed 150°C. It is recommended to derate the power dissipation at high temperatures to ensure reliable operation.
  • The TLV2376IDGKT has built-in ESD protection, but it is still recommended to follow proper handling and storage procedures to prevent ESD damage. Use an anti-static wrist strap or mat, and store the devices in anti-static packaging.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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