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TLV2442AMJGB - Texas Instruments

Description: OP Amp Dual GP R-R O/P ±5V/10V 8-Pin CDIP Tube

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TLV2442AMJGB - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8),
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TLV2442AMJGB - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8),
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TLV2442AMJGB Details

  • Manufacturer Part Number:

    TLV2442AMJGB

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    CERAMIC, DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00026 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    950 µV

  • JESD-30 Code:

    R-GDIP-T8

  • Length:

    9.58 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.4 V/us

  • Slew Rate-Nom:

    0.02 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    52

  • Voltage Gain-Min:

    700

  • Wideband:

    NO

  • Width:

    7.62 mm

TLV2442AMJGB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following a star-grounding topology, keeping analog and digital grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • The TLV2442AMJGB has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal relief pattern on the PCB to dissipate heat. Additionally, consider using thermal vias, heat sinks, or thermal interface materials to further reduce thermal resistance.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 100nF. Increasing the input capacitance can improve noise rejection, while increasing the output capacitance can improve stability and reduce ringing. However, excessive capacitance can degrade the amplifier's bandwidth and settling time.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins, and consider adding resistors in series with the inputs to limit the current during an ESD event. Additionally, follow proper handling and storage procedures to prevent ESD damage.
  • The TLV2442AMJGB is rated for operation from -40°C to 125°C. As the temperature increases, the amplifier's offset voltage, noise, and distortion may increase, while the bandwidth and slew rate may decrease. Ensure that the amplifier is operated within the recommended temperature range to maintain optimal performance.

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TLV2442AMJGB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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