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TLV2451CD - Texas Instruments

Description: Single Micropower Rail-To-Rail Input/Output Op Amp

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TLV2451CD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A (2021)
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TLV2451CD - Texas Instruments  - 3D model - Small Outline Packages - D0008A (2021)
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TLV2451CD Details

  • Manufacturer Part Number:

    TLV2451CD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.007 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00045 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.02 V/us

  • Slew Rate-Nom:

    0.11 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.042 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    220

  • Voltage Gain-Min:

    63095

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2451CD Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2451CD is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the MSOP package, it is 440mW at 25°C. Refer to the thermal characteristics table in the datasheet for more information.
  • To ensure stability in a unity-gain buffer configuration, make sure to use a capacitor with a value of at least 10nF between the output and the inverting input pins. This capacitor helps to compensate for the internal pole of the op-amp and prevents oscillations.
  • To minimize noise and EMI, it is recommended to use a star-ground configuration, keep the input and output traces short and away from each other, and use a ground plane to shield the op-amp. Additionally, decouple the power supply pins with a 10uF capacitor and a 100nF capacitor in parallel.
  • While the TLV2451CD can be used as a comparator, it is not recommended due to its relatively slow slew rate and limited output current. Texas Instruments recommends using a dedicated comparator such as the TLV7031 for comparator applications.
  • The input bias current of the TLV2451CD is typically around 1pA. However, this value can vary depending on the operating conditions and temperature. Refer to the electrical characteristics table in the datasheet for more information.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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