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TLV2451CDR - Texas Instruments

Description: Single Micropower Rail-To-Rail Input/Output Op Amp

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TLV2451CDR - Texas Instruments - PCB symbol
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TLV2451CDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - +soic d
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TLV2451CDR Details

  • Manufacturer Part Number:

    TLV2451CDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.007 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00045 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.02 V/us

  • Slew Rate-Nom:

    0.11 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.042 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    220

  • Voltage Gain-Min:

    63095

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2451CDR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground connection for the analog and digital grounds, and to keep the analog and digital signal traces separate to minimize noise coupling. Additionally, it's recommended to use a solid ground plane and to avoid routing digital signals under the device.
  • It's recommended to power up the VCC pin before the VIN pin, and to ensure that the VCC pin reaches its minimum operating voltage before applying a signal to the VIN pin. Additionally, it's recommended to add a power-up reset circuit to ensure that the device is properly reset during power-up.
  • The TLV2451CDR can drive up to 1000 pF of capacitive load, but excessive capacitive loading can affect the device's bandwidth and settling time. It's recommended to keep the capacitive load as low as possible and to use a series resistor to dampen the load if necessary.
  • The TLV2451CDR is specified to operate from -40°C to 125°C. Operating outside of this range can affect the device's performance, accuracy, and reliability. It's recommended to ensure that the device is properly heatsinked and that the ambient temperature is within the specified range.
  • Texas Instruments recommends using a soldering iron with a temperature of 260°C or less, and to avoid applying excessive heat or force during soldering or rework. Improper soldering or rework can damage the device or affect its performance, and can also cause the device to fail or become unreliable.

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TLV2451CDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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