Part Image

TLV2452CDGKR - Texas Instruments

Description: Dual Micropower Rail-To-Rail Input/Output Op Amp

Download TLV2452CDGKR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TLV2452CDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
click to zoom
3D Models
TLV2452CDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
click to zoom

TLV2452CDGKR Details

  • Manufacturer Part Number:

    TLV2452CDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.007 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00045 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.02 V/us

  • Slew Rate-Nom:

    0.11 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.084 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    220

  • Voltage Gain-Min:

    63095

  • Wideband:

    NO

  • Width:

    3 mm

TLV2452CDGKR Frequently Asked Questions (FAQs)

  • It is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • It is recommended to sequence the power supplies in the following order: analog power (VCC), digital power (VDD), and then the input voltage (VIN). This ensures that the internal circuitry is properly biased before the input voltage is applied.
  • The TLV2452CDGKR can drive up to 100pF of capacitive load. However, it's recommended to keep the capacitive load below 50pF to ensure stability and prevent oscillations. Excessive capacitive loading can cause the amplifier to oscillate or become unstable.
  • The gain and bandwidth of the TLV2452CDGKR can be optimized by selecting the appropriate gain resistors (Rf and Rg) and capacitor values (Cf and Cg). A higher gain will result in a lower bandwidth, and vice versa. It's recommended to use the TI's WEBENCH tool or consult the application notes for guidance on optimizing the gain and bandwidth for specific applications.
  • The TLV2452CDGKR has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. This can be achieved by providing adequate heat sinking, using a thermally conductive PCB material, and minimizing power dissipation.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV2452CDGKR Overview

Use the download button to access the TLV2452CDGKR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV24, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV2452CDGKR

Showing 0 results

TLV2452CDGKR Alternates

Showing results

Image Part Number Model
Part Image TLV2452CDGK Texas Instruments

Operational Amplifier, 2 Func, 1500uV Offset-Max, CMOS, PDSO8

Part Image TLV2452CDGKRG4 Texas Instruments

Operational Amplifier, 2 Func, 2000uV Offset-Max, CMOS, PDSO8

Part Image TLV2452CDGKG4 Texas Instruments

Operational Amplifier, 2 Func, 2000uV Offset-Max, CMOS, PDSO8