Part Image

TLV2452ID - Texas Instruments

Description: Texas Instruments TLV2452ID, Dual Op Amp, 0.22MHz Rail-Rail, 3 V, 5 V, 8-Pin SOIC

Download TLV2452ID Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TLV2452ID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D
click to zoom
3D Models
TLV2452ID - Texas Instruments  - 3D model - Small Outline Packages - D
click to zoom

TLV2452ID Details

  • Manufacturer Part Number:

    TLV2452ID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.007 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00045 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.02 V/us

  • Slew Rate-Nom:

    0.11 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.084 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    220

  • Voltage Gain-Min:

    63095

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2452ID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2452ID is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the VSSOP package, it is 440mW at 25°C. Refer to the thermal characteristics table in the datasheet for more information.
  • To ensure stability in a unity-gain buffer configuration, make sure to use a low-ESR capacitor (e.g., ceramic or film capacitor) with a value between 10nF to 100nF between the output and the inverting input. This capacitor helps to compensate for the op-amp's internal capacitance and ensures stability.
  • To minimize noise and EMI, follow these layout and routing guidelines: keep the input and output traces short and away from each other, use a solid ground plane, and place decoupling capacitors (e.g., 0.1uF ceramic capacitors) close to the power pins. Additionally, avoid running high-frequency signals near the op-amp's inputs and outputs.
  • The TLV2452ID is specified to operate from -40°C to 125°C. However, the device's performance may degrade at higher temperatures. If you need to operate the device at high temperatures, ensure that you follow proper thermal management practices, such as providing adequate heat sinking and airflow.
  • The TLV2452ID has built-in ESD protection, but it's still important to follow proper ESD handling practices when handling the device. Use an ESD wrist strap or mat, and ensure that your workspace is ESD-protected. Avoid touching the device's pins or handling it in a way that could generate static electricity.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV2452ID Overview

Use the download button to access the TLV2452ID schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV24, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV2452ID

Showing 0 results

TLV2452ID Alternates

Showing results

Image Part Number Model
Part Image TLV2452IDR Texas Instruments

Operational Amplifier, 2 Func, 1500uV Offset-Max, CMOS, PDSO8

Part Image TLV2452IDRG4 Texas Instruments

Operational Amplifier, 2 Func, 2000uV Offset-Max, CMOS, PDSO8