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TLV2453IDGSR - Texas Instruments

Description: Dual Micropower Rail-To-Rail Input/Output Op Amp w/Shutdown

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TLV2453IDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS (S-PDSO-G10)
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TLV2453IDGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS (S-PDSO-G10)
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TLV2453IDGSR Details

  • Manufacturer Part Number:

    TLV2453IDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.007 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00045 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.02 V/us

  • Slew Rate-Nom:

    0.11 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.084 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    220

  • Voltage Gain-Min:

    63095

  • Wideband:

    NO

  • Width:

    3 mm

TLV2453IDGSR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following a star-grounding layout, keeping the analog and digital grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • It is recommended to power up the VCC pin before the VIN pin, and power down the VIN pin before the VCC pin. This ensures that the internal circuitry is properly initialized and avoids latch-up or other issues.
  • The TLV2453IDGSR can drive up to 1nF of capacitive load. However, excessive capacitive loading can cause output instability and ringing. It is recommended to use a series resistor to dampen the output and ensure stability.
  • The TLV2453IDGSR has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) mechanisms. The OVP protects the device from input voltages above 6V, while the UVLO disables the device when the input voltage falls below 2.7V.
  • The thermal impedance of the QFN package is approximately 30°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 30°C above the ambient temperature. Proper thermal design and heat sinking are essential to ensure reliable operation.

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TLV2453IDGSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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