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TLV2462AIDRG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual Low-Power Rail-to-Rail I/O

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TLV2462AIDRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV2462AIDRG4 Details

  • Manufacturer Part Number:

    TLV2462AIDRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    1700 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5200

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2462AIDRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground layout, with the op-amp inputs and outputs connected to the analog ground plane, and the power supply pins connected to the power plane. Additionally, it's recommended to place the op-amp close to the signal sources and loads to minimize noise and parasitic capacitance.
  • The thermal shutdown feature is designed to protect the device from overheating. If the device exceeds the maximum junction temperature (TJ), it will shut down. To handle this, ensure good thermal design, such as providing adequate heat sinking and airflow. If thermal shutdown occurs, the device will recover automatically when the temperature drops below the threshold.
  • Texas Instruments recommends keeping the input capacitance below 10nF and the output capacitance below 100nF to ensure stability and minimize ringing. However, the optimal capacitance values may vary depending on the specific application and layout.
  • To minimize noise and EMI, use a low-noise power supply, keep the op-amp inputs and outputs away from noisy signals, use shielding and grounding techniques, and consider adding noise filters or bypass capacitors. Additionally, ensure good layout and routing practices, such as keeping signal traces short and avoiding parallel traces.
  • The maximum allowed voltage difference between the input pins is ±1.5V. Exceeding this limit can cause damage to the device or affect its performance. Ensure that the input signals are within the recommended common-mode voltage range.

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TLV2462AIDRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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