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TLV2462CDG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual Low-Power Rail-to-Rail I/O

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TLV2462CDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV2462CDG4 Details

  • Manufacturer Part Number:

    TLV2462CDG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.025 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    6400

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2462CDG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground layout, with the TLV2462CDG4 placed close to the analog signal sources and away from digital signal lines. Additionally, it's recommended to use a solid ground plane and to minimize the length of the input traces.
  • The TLV2462CDG4 has a built-in POR and BOR circuitry. To handle these, ensure that the power supply voltage rises monotonically and does not drop below the minimum specified voltage during power-up. Also, add a capacitor between the VCC pin and ground to filter out noise and ensure a clean power-up.
  • The TLV2462CDG4 can drive a maximum capacitive load of 100 pF. Exceeding this limit may cause oscillations or instability in the output. If a larger capacitive load is required, consider adding a buffer or an op-amp with a higher drive capability.
  • To reduce noise and EMI, use a low-ESR capacitor for power supply decoupling, keep the analog signal traces short and away from digital signal lines, and use a shielded enclosure or a metal can package for the TLV2462CDG4. Additionally, consider adding a ferrite bead or a common-mode choke to the power supply lines.
  • The thermal resistance of the TLV2462CDG4 package (SOIC-14) is typically around 45°C/W (junction-to-ambient) and 10°C/W (junction-to-case). This information is usually available in the package thermal characteristics section of the datasheet or in a separate application note.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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