Part Image

TLV2463IDGS - Texas Instruments

Description: Dual Low-Power, Rail-to-Rail Input/Output Operational Amplifier w/Shutdown

Download TLV2463IDGS Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TLV2463IDGS - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
click to zoom
3D Models
TLV2463IDGS - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
click to zoom

TLV2463IDGS Details

  • Manufacturer Part Number:

    TLV2463IDGS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    6400

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    3 mm

TLV2463IDGS Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground layout, with the op-amp's ground pin connected to a central ground point. Additionally, it's recommended to place the op-amp close to the signal source and to use short, direct traces to minimize noise and parasitic capacitance.
  • The TLV2463IDGS has a specific power-up and power-down sequencing requirement to prevent latch-up. The recommended sequence is to power up the VCC pin first, followed by the VIN pin, and then the VREF pin. During power-down, the sequence should be reversed.
  • The TLV2463IDGS can drive a maximum capacitive load of 100 pF. Exceeding this limit may cause oscillation or instability in the op-amp.
  • To minimize noise and EMI, use a ground plane, keep the op-amp's input and output traces short and away from noise sources, and use shielding or guard rings around sensitive signals. Additionally, consider using a low-pass filter or a ferrite bead to filter out high-frequency noise.
  • The thermal resistance of the TLV2463IDGS package (MSOP-8) is typically around 45°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 45°C above the ambient temperature.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV2463IDGS Overview

Use the download button to access the TLV2463IDGS schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV24, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV2463IDGS

Showing 0 results

TLV2463IDGS Alternates

Showing results

Image Part Number Model
Part Image TLV2463IDGSR Texas Instruments

Operational Amplifier, 2 Func, 2000uV Offset-Max, CMOS, PDSO10

Part Image TLV2463IDGS Rochester Electronics LLC

DUAL OP-AMP, 2200uV OFFSET-MAX, 5.2MHz BAND WIDTH, PDSO10, GREEN, PLASTIC, MSOP-10

Part Image TLV2463IDGSR Rochester Electronics LLC

DUAL OP-AMP, 2200uV OFFSET-MAX, 5.2MHz BAND WIDTH, PDSO10, GREEN, PLASTIC, MSOP-10

Part Image TLV2463IDGSG4 Texas Instruments

Operational Amplifier, 2 Func, 2200uV Offset-Max, CMOS, PDSO10

Part Image TLV2463IDGSRG4 Texas Instruments

Operational Amplifier, 2 Func, 2200uV Offset-Max, CMOS, PDSO10

For a full list of alternate parts for TLV2463IDGS, check out Findchips.com