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TLV2464AMDREP - Texas Instruments

Description: Enhanced Product Low-Power Rail-To-Rail Input/Output Operational Amplifier With Shutdown

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TLV2464AMDREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLV2464AMDREP - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLV2464AMDREP Details

  • Manufacturer Part Number:

    TLV2464AMDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Supply Current-Max:

    2.6 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    6400

  • Voltage Gain-Min:

    28000

  • Wideband:

    NO

  • Width:

    3.905 mm

TLV2464AMDREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLV2464 application note (SLVAU02). It suggests using a star-ground configuration, keeping the input and output traces short and separate, and using a solid ground plane to minimize noise and EMI.
  • The thermal shutdown feature is activated when the junction temperature exceeds 150°C. To handle this, ensure good thermal design, use a heat sink if necessary, and implement a thermal monitoring system to detect and respond to thermal shutdown events.
  • The recommended input capacitor value is 1-10 μF, depending on the input voltage and noise requirements. A larger capacitor can help filter out noise, but may increase the startup time and affect the overall system performance.
  • Yes, TLV2464AMDREP is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure that the device is properly derated and that the system is designed to accommodate the reduced performance and potential errors.
  • To ensure EMC, follow proper PCB layout and design guidelines, use shielding and filtering components, and implement a robust power supply design. Additionally, consider using a ferrite bead or common-mode choke to reduce EMI emissions.

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TLV2464AMDREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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