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TLV2471IDR - Texas Instruments

Description: Single Low-Power Rail-to-Rail Input/Output Op Amp

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TLV2471IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV2471IDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV2471IDR Details

  • Manufacturer Part Number:

    TLV2471IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    2200 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.6 V/us

  • Slew Rate-Nom:

    1.5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2800

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2471IDR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2471IDR is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the VSSOP package, it is 440mW at 25°C. Refer to the thermal characteristics table in the datasheet for more information.
  • To ensure stability in a unity-gain buffer configuration, make sure to use a bypass capacitor between the VCC pin and ground, and a decoupling capacitor between the VCC pin and the output pin. The recommended values are 0.1uF and 10nF, respectively. Additionally, ensure that the layout is well-designed to minimize parasitic inductance and capacitance.
  • The recommended input impedance for the TLV2471IDR is greater than 1kΩ to ensure optimal performance. Lower input impedances can lead to reduced bandwidth and increased distortion.
  • The TLV2471IDR is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation will decrease. Ensure that the device is properly heat-sinked and that the maximum junction temperature is not exceeded.
  • To reduce noise and EMI, use a well-designed PCB layout with a solid ground plane, and ensure that the device is properly bypassed and decoupled. Additionally, use shielding and filtering techniques, such as ferrite beads and common-mode chokes, to reduce EMI.

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TLV2471IDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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