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TLV2473IDGQR - Texas Instruments

Description: Dual Low-Power Rail-to-Rail Input/Output Op Amp w/Shutdown

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TLV2473IDGQR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGQ0010D
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TLV2473IDGQR - Texas Instruments  - 3D model - Small Outline Packages - DGQ0010D
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TLV2473IDGQR Details

  • Manufacturer Part Number:

    TLV2473IDGQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    2200 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.6 V/us

  • Slew Rate-Nom:

    1.5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.8 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2800

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2473IDGQR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a star-ground configuration, where the analog and digital grounds are separated and connected at a single point. Additionally, it's recommended to place the TLV2473IDGQR close to the analog signal sources and away from digital signal lines to minimize noise coupling.
  • The POR and BOR features of the TLV2473IDGQR are designed to ensure that the device powers up in a known state. To handle these features, ensure that the power supply voltage rises monotonically and does not drop below the minimum operating voltage during power-up. Also, add a capacitor to the VCC pin to filter out noise and ensure a clean power-up sequence.
  • The TLV2473IDGQR can drive a maximum capacitive load of 150 pF. Exceeding this limit may cause instability or oscillations in the output signal. If a larger capacitive load is required, consider adding a buffer amplifier or reducing the capacitive load through impedance matching.
  • To ensure EMC with the TLV2473IDGQR, follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding parallel traces that can create antennas. Additionally, use shielding and filtering techniques to reduce electromagnetic radiation and susceptibility.
  • The thermal resistance of the TLV2473IDGQR package is typically around 30°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 30°C. To ensure optimal performance, keep the device within its recommended operating temperature range and use thermal management techniques, such as heat sinks or thermal vias, to reduce the junction temperature.

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TLV2473IDGQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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