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TLV2543IDB - Texas Instruments

Description: 12-Bit 66 kSPS ADC Ser. Out, Pgrmable Pwrdn, MSB/LSB First, Built-In Self-Test Mode, 11 Ch.

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TLV2543IDB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB (R-PDSO-G**)
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TLV2543IDB - Texas Instruments  - 3D model - Small Outline Packages - DB (R-PDSO-G**)
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TLV2543IDB Details

  • Manufacturer Part Number:

    TLV2543IDB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    3.6 V

  • Conversion Time-Max:

    10 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    7.2 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    11

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.066 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

TLV2543IDB Frequently Asked Questions (FAQs)

  • It is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • The TLV2543IDB is rated for operation from -40°C to 125°C. Ensure good thermal design and heat dissipation, and consider using a heat sink if the device will be operating at high temperatures or with high power dissipation.
  • Power up the device in the following sequence: VCC, AVCC, and then the digital inputs. This ensures that the analog and digital sections are powered up correctly and reduces the risk of latch-up or damage.
  • When an analog input pin is not in use, it is recommended to tie it to a fixed voltage (e.g., VCC or GND) through a resistor to prevent noise and oscillations. Alternatively, use a voltage clamp or a buffer amplifier to stabilize the input.
  • Use a buffer amplifier or an op-amp to drive the analog output pins, especially if the output is connected to a long cable or a capacitive load. This ensures that the output signal is not distorted or attenuated.

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TLV2543IDB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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