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TLV2543IDW - Texas Instruments

Description: 12-Bit 66 kSPS ADC Ser. Out, Pgrmable Pwrdn, MSB/LSB First, Built-In Self-Test Mode, 11 Ch.

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TLV2543IDW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW(R-PDSO-G20)
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TLV2543IDW - Texas Instruments  - 3D model - Small Outline Packages - DW(R-PDSO-G20)
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TLV2543IDW Details

  • Manufacturer Part Number:

    TLV2543IDW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    3.6 V

  • Analog Input Voltage-Min:

    3 V

  • Conversion Time-Max:

    10 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.825 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    11

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.066 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TLV2543IDW Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital grounds separate. Additionally, it's recommended to use a star-configuration for the power supply and to keep the signal traces short and direct.
  • The TLV2543IDW has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. It's recommended to use a thermal interface material (TIM) and to design the PCB with thermal vias to improve heat dissipation.
  • The recommended power-up sequence is to first apply the analog power supply (AVDD), followed by the digital power supply (DVDD), and finally the clock signal. This ensures that the internal biasing and reference circuits are properly initialized.
  • To optimize performance, use a low-pass filter on the analog input, keep the analog and digital grounds separate, and use a shielded enclosure to reduce EMI. Additionally, use a common-mode filter on the output to reduce noise and EMI.
  • The TLV2543IDW has an internal calibration circuit that can be used to calibrate the device. The recommended method is to use the internal calibration circuit and to perform a self-calibration procedure at power-up or during device initialization.

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TLV2543IDW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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