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TLV2553IDWR - Texas Instruments

Description: 12-Bit, 200 KSPS, 11 Channel, Low Power, Serial ADC Serial Out, w/Pwrdwn

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TLV2553IDWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW
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TLV2553IDWR Details

  • Manufacturer Part Number:

    TLV2553IDWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    5.5 V

  • Analog Input Voltage-Min:

    2.7 V

  • Conversion Time-Max:

    4.15 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.825 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    11

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TLV2553IDWR Frequently Asked Questions (FAQs)

  • It is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • Ensure good thermal conduction by mounting the device on a heat sink or a thermally conductive PCB, and avoid blocking airflow around the device. Monitor the device's junction temperature (TJ) to ensure it stays within the specified range of -40°C to 125°C.
  • Power up the device in the following sequence: VCC, then AVCC, and finally the digital inputs. Ensure that the power supplies are stable and within the specified voltage range before applying digital inputs.
  • Ensure that the output current does not exceed the specified maximum current of 10mA per channel. Use external current-limiting resistors or buffers if necessary, and monitor the device's temperature to prevent overheating.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines, and ensure that the PCB is designed with ESD protection in mind. Handle the device by the body or use an anti-static wrist strap to prevent static discharge.

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TLV2553IDWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV2553IDWRG4 Texas Instruments

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