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TLV2553IPWG4 - Texas Instruments

Description: 11-Channel Single ADC SAR 200ksps 12-bit Serial 20-Pin TSSOP Tube

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TLV2553IPWG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G20)
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TLV2553IPWG4 - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G20)
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TLV2553IPWG4 Details

  • Manufacturer Part Number:

    TLV2553IPWG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    GREEN, PLASTIC, TSSOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog Input Voltage-Max:

    5.5 V

  • Conversion Time-Max:

    4.15 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    11

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TLV2553IPWG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended layout and routing guide in the TLV2553 datasheet, which includes guidelines for PCB layout, component placement, and routing to minimize noise and ensure optimal performance.
  • The TLV2553IPWG4 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour can be used to connect the thermal pad to the thermal plane. Additionally, the device's power consumption and ambient temperature should be considered to ensure the device operates within its recommended temperature range.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 100nF. However, the optimal capacitance values may vary depending on the specific application and operating conditions. It's recommended to consult the datasheet and application notes for more information.
  • The TLV2553IPWG4 requires a single 2.7V to 5.5V power supply, and the device's input and output pins must be properly biased. The datasheet provides guidelines for power supply decoupling, input and output voltage ranges, and biasing requirements. Additionally, the device's power-on reset and enable pins should be properly configured to ensure correct operation.
  • The TLV2553IPWG4 is a 12-bit, 3.5 MSPS analog-to-digital converter, and its maximum operating frequency is 3.5 MSPS. However, the device's operating frequency can be adjusted using the clock input pin, and the device can operate at lower frequencies depending on the application requirements.

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TLV2553IPWG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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