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TLV2621IDBVT - Texas Instruments

Description: 800 uA/ch, 11MHz, RRO, Low Voltage, Single Channel Op Amp

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TLV2621IDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
TLV2621IDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV2621IDBVT Details

  • Manufacturer Part Number:

    TLV2621IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    78 dB

  • Common-mode Reject Ratio-Nom:

    99 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    2.3 V/us

  • Slew Rate-Nom:

    6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    11000

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2621IDBVT Frequently Asked Questions (FAQs)

  • The TLV2621IDBVT is a high-frequency device, so it's essential to follow good layout practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using short traces, and avoiding vias under the device. Additionally, it's crucial to decouple the power supply with a 10uF capacitor and a 100nF capacitor in parallel.
  • To optimize the performance of the TLV2621IDBVT, it's essential to understand the specific requirements of your application. Consider factors such as the input signal frequency, amplitude, and impedance, as well as the desired output voltage and current. TI provides a range of application notes and design tools to help you optimize the device's performance in your specific application.
  • The TLV2621IDBVT is a high-power device, and thermal management is crucial to ensure reliable operation. TI recommends using a thermal pad or a heat sink to dissipate heat, especially in high-power applications. The device's thermal resistance (θJA) is 28.5°C/W, and the maximum junction temperature is 150°C.
  • When troubleshooting issues with the TLV2621IDBVT, start by verifying the power supply voltage, input signal, and output voltage. Check for proper decoupling, layout, and thermal management. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue. TI also provides a range of resources, including application notes and FAQs, to help you troubleshoot common issues.
  • The TLV2621IDBVT has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent damage. TI recommends using anti-static wrist straps, mats, and packaging to prevent ESD damage. Additionally, ensure that the device is properly powered down during storage and transportation to prevent latch-up.

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TLV2621IDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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