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TLV272CDG4 - Texas Instruments

Description: OPERATIONAL AMPLIFIERS

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TLV272CDG4 - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-8N
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TLV272CDG4 - Texas Instruments  - 3D model - Other - SOIC127P600X175-8N
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TLV272CDG4 Details

  • Manufacturer Part Number:

    TLV272CDG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.32 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    70795

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV272CDG4 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV272CDG4 is dependent on the ambient temperature and the package type. For the DG4 package, the maximum power dissipation is 670mW at 25°C ambient temperature. However, it's recommended to derate the power dissipation by 6.7mW/°C above 25°C.
  • While the TLV272CDG4 is an op-amp, it's not recommended to use it as a comparator. The device is not designed for comparator applications and may not provide reliable performance. Texas Instruments recommends using a dedicated comparator device, such as the TLV703, for comparator applications.
  • The input impedance of the TLV272CDG4 is typically around 10^12 ohms in parallel with 2pF. This is due to the high input impedance of the op-amp's input stage and the internal compensation capacitor.
  • The TLV272CDG4 is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation must be derated accordingly. It's recommended to consult the datasheet and application notes for more information on high-temperature operation.
  • The TLV272CDG4 can source or sink up to 10mA of output current. However, the output current capability may be limited by the power dissipation and the output voltage swing. It's recommended to consult the datasheet and application notes for more information on output current capability.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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