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TLV272CDRG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps 550-uA/Ch 3-MHz Rail-to-Rail Out

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TLV272CDRG4 Details

  • Manufacturer Part Number:

    TLV272CDRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.32 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    70795

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV272CDRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the device placed close to the power supply pins, and the input and output pins should be routed away from each other to minimize noise coupling. A ground plane is also recommended to reduce noise and improve thermal performance.
  • The TLV272CDRG4 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane or a heat sink to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink or thermal ground plane.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 100nF. However, the optimal capacitance values may vary depending on the specific application and operating conditions.
  • To ensure stability, the TLV272CDRG4 requires a minimum output capacitance of 10nF, and the output should be decoupled from the input with a series resistor. Additionally, the device should be operated within its recommended operating conditions, and the input and output voltages should be within the specified ranges.
  • The TLV272CDRG4 has built-in ESD protection on the input and output pins, which can withstand up to 2kV of electrostatic discharge according to the Human Body Model (HBM). However, additional ESD protection measures may be necessary depending on the specific application and operating environment.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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